: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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100 KW Semiconductor Molding Machine Automatic Encapsulation System

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Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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Guangdong Taijin Semiconductor Technology Co., Ltd

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City: Dongguan

Province/State: Guangdong

Country/Region: China

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100 KW Semiconductor Molding Machine Automatic Encapsulation System

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100 KW Semiconductor Molding Machine Automatic Encapsulation System

Automatic Encapsulation System Product Details: ● Automatic cassette loading, double cassette stacked loading; ● Supports flexible expansion of up to 4 groups of presses to realize high UPH; ● ...

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Semiconductor Molding Machine Automatic Encapsulation

100 KW Semiconductor Molding Machine

Automatic Encapsulation semiconductor equipment

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